Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

摘要

According to one embodiment, there is provided a printed-wiring board with a built-in component including a first base material including a pattern forming surface on which a plurality of conductive patterns are formed. A circuit component is mounted on the pattern forming surface of the first base material, and is connected to the conductive patterns of the first base material. A filling material is stacked on the pattern forming surface of the first base material, and fills in a gap between the circuit component and the pattern forming surface. A second base material is stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.