| 摘要 |
A contact structure can comprise a core structure on a substrate and over coat material on the core structure. The over coat material can be harder or have a greater yield strength than the material of the core structure. The core structure can be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool can be moved to impart a desired shape to the wire. The wire can be severed from the spool and over coated. As an alternative, the wire need not be over coated. The substrate can be an electronic device, such as a semiconductor die.
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