发明名称 Connecting Part of Conductor Pattern and Conductor Patterns-Connected Structure
摘要 The present invention discloses: a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.
申请公布号 US2008068272(A1) 申请公布日期 2008.03.20
申请号 US20070857660 申请日期 2007.09.19
申请人 LINTEC CORPORATION 发明人 MATSUSHITA TAIGA;KATAKURA KATUMI;MATSUURA KATSUYOSHI
分类号 H05K1/14 主分类号 H05K1/14
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