| 摘要 |
A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the first conductive pillars being exposed from the first insulating layer; forming on the first conductive pillars a second wiring layer that is electrically connected to the first conductive pillars; forming a plurality of second conductive pillars on the second wiring layer; forming on the first insulating layer a second insulating layer that covers the second wiring layer and the second conductive pillars, with terminal surfaces of the second conductive pillars being exposed from the second insulating layer; and removing the carrier. The first conductive pillars have terminal surfaces in geometric shapes, except for a circle. Therefore, the interposer substrate can have a layout on demands, and can be designed at a designer's will. The present invention also provides the interposer substrate. |
