METHOD AND DEVICE FOR TREATING OBJECTS WITH A LIQUID

摘要

In the treatment of a semiconductor wafer (8), a treatment medium, in particular an etching or cleaning liquid, is applied to the semiconductor wafer (8) from a nozzle (11). In this process, the temperature, the concentration and/or the amount of medium applied in the unit of time are controlled depending on the location (7) at which the medium is being applied to the semiconductor wafer (8). In this manner, uniform treatment of the semiconductor water (8) is achieved because irregularities in the semiconductor wafer (8) can be compensated.

主权项

1. A method for treating objects (8) with a medium, in particular a liquid, characterized by the steps
application of the medium onto the surface of the object (8) to be treated by means of an application arrangement (11), which is moved relative to the object (8) to be treated over the surface of the object (8) to be treated, controlling of characteristics of the medium to be applied onto the object to be treated depending on the position of the application arrangement (11) relative to the surface of the object (8) to be treated, controlling of the temperature of the medium to be applied onto the object (8) to be treated, wherein the temperature is detected by means of a temperature sensor (9), which is associated with the application arrangement, in particular its nozzle (11).