| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a flexible device whose variation in film thickness is small and malfunction is hard to occur, and also to provide the flexible device using the same.SOLUTION: A substrate includes: polyimide whose 5% thermal decomposition temperature is 350°C or more; a compound having a chemical structure represented by the following general formula (1) and/or a chemical structure represented by -CF-; a compound having one or more of the group consisting of a chemical structure represented by (γ)-(CH2)nO-, a hydroxyl group, a carboxyl group and a sulfo group; and a compound having the chemical structure of -Si(OH)3 having at least one or more of functional groups of the group consisting of an amide group, an amino group, a carbamate group, a carboxyl group, an aryl group, an acid anhydride group, and a polymerizable cyclic ether group.SELECTED DRAWING: None |
