| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer method and apparatus in which a gluing starting position is automatically determined to start gluing when sequentially gluing chip components on a sheet on a wafer table, and the chip components can be efficiently glued within a gluing range. SOLUTION: A Y coordinate of the gluing starting position to first glue a chip component on a sheet 5 is determined from a radius R for the circular gluing range of the sheet 5 and a Y-direction dimension Y1 of chip components 55, an X coordinate of the gluing starting position to first glue the chip component 55 on the sheet 5 is determined based on an X-direction pitch L1, and chip components are sequentially glued and transferred onto the sheet from the gluing starting position. COPYRIGHT: (C)2007,JPO&INPIT |
