| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for stably mixing a curable resin composition whereby, when manufacturing a composition by using a resin for a semiconductor package, which requires heat resistance and light resistance and cures by a hydrosilyl reaction or the like, it is possible to prevent the occurrence of residence caused by the curable resin composition to be wound on or caught in a mixing wing during mixing.SOLUTION: There is provided a manufacturing method of a curable resin composition containing (A) a curable resin, (B) a white resin and (C) an inorganic filler as essential components, including mixing with a mixer, where a mixing wing with two shafts revolves and each shaft rotates independently, two shafts rotate in different directions respectively and two shaft mixing wing shapes have different shapes, one shape of the mixing wing is a screw beater shape and another is a screw hook shape and thickness of the mixing wing is 30 mm or more.SELECTED DRAWING: None |
