| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high heat resistance and high reliability.SOLUTION: In a high heat-resistant solder bonded semiconductor device, a semiconductor element and a substrate are bonded with a solder that expresses super plasticity. The high heat-resistant solder bonded semiconductor device is characterized in that the solder is protruded to the outside from an end of the semiconductor element while the solder is kept in a semi-molten state to prevent the solder from flowing out and the solder is to be swelled to an upper side than a lower face of the semiconductor element, and then, the solder is allowed to express super plasticity, and stress strain at the interface between the solder and the semiconductor element and stress strain at the interface between the solder and the substrate are suppressed.SELECTED DRAWING: Figure 1 |
