| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder application device which facilitates control of the height of a top part of a rising flow of a solder with simple constitution, is capable of correcting and keeping a solder surface parallel to a back side of a printed circuit board at the time of generation of an inclined solder surface, and favorable from the stand point of manufacturing cost. SOLUTION: Relating to a solder application device 1 that an application area 60 of a member 6 to which a solder is applied is brought into contact with a top part a5 of a rising flow a2 of a solder A to be guided by a nozzle 5, the nozzle 5 is provided with adjustment holes 56, 57 for returning a part of the rising flow a2 of the solder A to a storage hole 2 below a liquid solder surface S1 to divide the rising flow a2 of the solder A into a portion overflowing form the top part a5 and portions a3, a4 flowing out of the adjustment holes 56, 57.
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