| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide composition that achieves a low thermal expansion coefficient and high heat resistance, and is also excellent in the solubility of polyamic acid varnish.SOLUTION: The present invention provides a polyamide acid composition and a polyimide composition, comprising a tetracarboxylic acid compound comprising an aromatic tetracarboxylic acid compound having a naphthalene skeleton, and a diamine compound comprising an aromatic diamine compound having a biphenyl skeleton.SELECTED DRAWING: None |
