| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste composition that is preferable in the point of reducing environmental load by filling a via hole with an ordinary printing method and can provide a very small resistance value of via because of failure-free via and higher connection reliability of via. SOLUTION: In the conductive paste composition for filling vias of a multilayer circuit board, conductive powder and binder element are included in the predetermined ratio of mass, the conductive particle is formed of lead-free solder particle (first alloy particle) having the melting point of 130°C or higher but 240°C or lower and at least one or more kinds of metal (second metal particle) selected from groups formed of Au, Ag, Cu, the first alloy particle and the second metal particle are contained in the predetermined ratio of mass, the binder element is formed of a mixture of mixture (binder element 1) of polymer type monomer that is cured with heat treatment and a thermosetting resin composition (binder element 2) under the melting point when Tg is the first alloy particle, and the binder element 1 is formed of a mixture including a kind of maleimide. COPYRIGHT: (C)2008,JPO&INPIT |
