| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively prevent occurrence of separation and a crack of a mold resin layer around an opening on the surface of a semiconductor element, in the semiconductor element formed so as to expose a part of the surface of the semiconductor element by forming an opening on a mold resin layer molding the semiconductor element. <P>SOLUTION: The semiconductor element 12 is mounted on a lead frame 13, connected thereto by bonding wires 15, and thereafter resin-sealed by the mold resin layer 14 to compose a semiconductor sensor 11. On the mold resin layer 14, the opening 14a for exposing a detection part 12a at the center part of a surface of the semiconductor element 12 is formed. A recessed groove part 16 located in a peripheral part of the opening 14a of the mold resin layer 14, that is, a part between the detection part 12a and electrode parts 12b is formed on the surface of the semiconductor element 12. The mold resin enters the recessed groove part 16 and cures, thereby, increasing joint strength by an anchor effect. <P>COPYRIGHT: (C)2009,JPO&INPIT |
