MOISTURE CURABLE COMPOSITIONS

摘要

The present invention provides curable compositions comprising non-tin metal accelerators that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present invention provides an accelerator comprising amide compounds that are particularly suitable as replacements for organotin in sealant and RTV formulations. Further, the compositions employing an amide compound is comparable or superior to organotin such as DBTDL, exhibits certain behavior in the presence of components that allow for tuning or adjusting the cure characteristics of the compositions, and provides good adhesion and storage stability.

主权项

1. A composition for forming a curable polymer composition comprising:
(A) a polymer having at least a reactive silyl group; (B) a crosslinker or chain extender; (C) a condensation accelerator comprising an amide compound; (D) optionally an adhesion promoter; (E) optionally, a filler component; (F) optionally, a cure modifier; (G) optionally, an organo-functional silicon compound, a low-molecular-weight organic polymer, a high-boiling-point solvent, or a combination of two or more thereof; and (H) optionally, an auxiliary component.