发明名称 CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable composition capable of forming a cured material excellent in flexibility, transparency, chemical resistance and bonding property to a substrate. SOLUTION: This curable composition contains a diene-based polymer having hydroxy or carboxy group and a part or the whole of it is hydrogenated, an epoxysilicone having≤300 epoxy equivalent and a cationic polymerization catalyst. It is preferable not to contain a polysilsesquioxane having oxetanyl group. Also, the curing catalyst is preferably an aluminum compound. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006152087(A) 申请公布日期 2006.06.15
申请号 JP20040342927 申请日期 2004.11.26
申请人 TOAGOSEI CO LTD;STANLEY ELECTRIC CO LTD 发明人 TAJIMA SEITARO;SUZUKI HIROSHI;SUGINO HIROAKI;MORITA YASUMASA
分类号 C08G59/20 主分类号 C08G59/20
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