| 摘要 |
An apparatus for inspecting a ball-bumped wafer is provided in which an wafer to be inspected, in which a plurality of chips having ball bumps are formed, is mounted on a wafer table; an inspection light is irradiated from a light projection optical system to the wafer mounted on the wafer table; an intensity of the reflected light from a surface, including a bump surface, of the wafer is detected by a detection optical system; and a shape, such as a height, a diameter and a position, of the ball bump is measured on the basis of the intensity of the inspection light.
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