A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
申请公布号
EP1900777(A1)
申请公布日期
2008.03.19
申请号
EP20060746558
申请日期
2006.05.17
申请人
NITTO SHINKO CORPORATION;E.I. DU PONT DE NEMOURS AND COMPANY;DUPONT TEIJIN ADVANCED PAPERS (JAPAN) LIMITED
发明人
IMAI, MASANORI;TAKAYAMA, HIDENORI;TAKAHASHI, YOSHIKI;KIHARA, YASUYUKI;ANDERSON, DAVID WAYNE;NARUSE, SHINJI;TANAKA, YASUNORI
