| 摘要 |
A structure of backlight plate (1) having embedded light emitting diodes (LEDs) and a method of fabricating the same, comprising a PCB (2) which may have a plurality of arc-shaped concave cups (31) and necessary circuitry implemented thereon; a gold layer (4) of nanometer thickness being sputtered onto surfaces of the PCB and a plurality of arc-shaped concave cups (31); a LED die (32) being implanted in each one of arc-shaped concave cups (31), and the LED die (32) being fixed to the center of arc-shaped concave cup (31); the LED die (32) being covered by a phosphor molding compound (37) made of phosphor and silica gel; and each one of a plurality of arc-shaped concave cups (31) and its neighboring PCB (2) being covered by a transparent layer (38) formed of transparent silica gel. |
