| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus capable of detecting non-bonding even for the device of extremely low capacitance. <P>SOLUTION: The wire bonding apparatus for connecting the electrode of a semiconductor chip mounted on a bonding stage 50 and the lead of a lead frame by a wire includes: an application means for applying DC pulses to the bonding stage 50; a detection means for detecting a response waveform from the bonding stage obtained by applying the DC pulses; and a decision means for deciding whether the wire or a bump is normally bonding-connected by comparing the response waveform with a non-bonding response waveform from the bonding stage obtained by applying the DC pulses to the bonding stage when bonding is not bonded. <P>COPYRIGHT: (C)2009,JPO&INPIT |
