发明名称 Airflow Heatsink For Led Devices
摘要 Disclosed is an LED lighting system with improved airflow and heat dissipation qualities. In one embodiment, the system comprises a heatsink mounted to an LED chip, and a fan assembly blowing air into the heatsink. The fan assembly includes a plurality of fans, the wind tunnels of the plurality of fans providing greater airflow in the center of the heatsink than a conventional one-fan configuration. In a further aspect, the disclosed system comprises a light head assembly in which cool air enters the light head assembly via the bottom and rear, and hot air is drawn out of the top of the light head assembly. An airflow path is created by selectively placing fans, baffles, walls, and openings in the lighting assembly.
申请公布号 US2016245493(A1) 申请公布日期 2016.08.25
申请号 US201314025466 申请日期 2013.09.12
申请人 Eustace Brian;Davis Michael;Jensen Christian 发明人 Eustace Brian;Davis Michael;Jensen Christian
分类号 F21V29/00 主分类号 F21V29/00
代理机构 代理人
主权项
地址 Sierra Madre CA US