| 摘要 |
The purpose of the present invention is to provide a wafer lens production method capable of simply and precisely molding an optical surface while preventing damage to a substrate caused by mold release, when molding a lens surface or other optical surface on both surfaces of the substrate. A second molding surface (103a) is released from a second metal mold (42) be-fore a first molding surface (102a) is completely released from a first metal mold (41) and, as a result, a releasing force is applied at the same time to both the first and second molding surfaces (102a, 103a) of the substrate (101) in a state such that an uneven force could not be readily applied, enabling the prevention of damage to the substrate (101) at mold release even for comparative-ly thin substrates (101). In addition, the mold release occurs with the sections of the first and second molding surfaces (102a, 103a) that have not been released remaining in each, thereby enabling the simple and efficient production of a precise wafer lens (100) without requiring the provision of a separate step for protecting first and second optical surfaces (11d, 12d) on the opposite side at mold release. |
