| 摘要 |
Disclosed is a resin composition for cleaning a resin processing machine, which exhibits good handleability during cleaning work and high cleaning performance. Specifically disclosed is a resin composition for cleaning, which is molded into a desired shape and contains, per 100 parts by mass of a thermoplastic resin (a), 1-10 parts by mass of a surfactant (b) and 20-200 parts by mass of a glass fiber (c-1). This resin composition for cleaning is characterized in that swarf derived from the component (c-1) is contained in an amount of not more than 0.2% by mass and the void ratio (V) represented by the formula (I) below satisfies the relation of V < 0.63. V = (1-bulk density of resin composition for cleaning)/(density of resin composition for cleaning) (I).
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