| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for dicing which exhibits good adhesiveness to an element substrate on which a plurality of semiconductor elements are formed, and to provide a method of manufacturing a semiconductor chip using the same.SOLUTION: An adhesive tape 1 for dicing that is used when dividing an element substrate, where a plurality of semiconductor elements are formed and each semiconductor element is sealed by sealing resin, or an element substrate where a lens material is formed on respective semiconductor elements, into a plurality of semiconductor chips includes a substrate 2, and an adhesive layer 3 laminated on the substrate 2 and containing a curable silicon-based adhesive and a hardener.SELECTED DRAWING: Figure 1 |
