| 发明名称 |
MOLDED LEAD FRAME PACKAGE WITH EMBEDDED DIE |
| 摘要 |
A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical convection between the first side and the second side of the semiconductor package. |
| 申请公布号 |
US2016207759(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201414915032 |
申请日期 |
2014.08.29 |
| 申请人 |
ROBERT BOSCH GMBH |
发明人 |
Salmon Jay Scott;Hansen Uwe |
| 分类号 |
B81B7/00;H04R19/00;B81C1/00;H01L21/48;H01L23/498;H01L23/495 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a first side; a second side opposite the first side; a molded substrate; a die embedded in the molded substrate, the die includes a first electrical contact surface positioned on a first side of the die; and a lead frame embedded in the molded substrate and positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package. |
| 地址 |
Stuttgart DE |
