| 摘要 |
A lead frame and a fabrication method thereof includes a metallic plate locally fabricated in double sides to form accurately aligned and closely spaced circuits. The metallic plate is also locally fabricated in single side to form patterned trenches. A filling material is filled into the trenches to provide extra mechanical support and separate the metallic plate into a plurality of conductive regions or regions with special electric properties. It can overcome the conventional problems in lead frame fabrication and has the advantages of a superior heat-dissipating ability, multi-leads and diversified applications.
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