| 摘要 |
A heat transfer plate adapted for direct contact with heat-generating electronic devices on a circuit board and including a pair of retainer assemblies adapted to releasably retain the plate within an electronic enclosure structure in a relationship wherein the edges of the plate are positioned in a direct, compressive, surface-to-surface relationship with the cold wall of the electronic enclosure structure to allow the direct transfer, via conduction, of the heat generated by the electronic devices on the circuit board from the edges of the plate into the cold wall. The retainer assembly comprises, among other elements, a rotatable rod with a head defining an interior cavity adapted to receive the head of a standard tool for rotating the rod. |
