发明名称 ELECTRONIC COMPONENTS EMBEDDED PCB AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A printed-circuit board including electronic component and a method for manufacturing the printed-circuit board are provided to improve positional precision by improving an inter-layer registration. CONSTITUTION: A first substrate(14) including a first insulation layer(2) and a first circuit pattern is prepared. The first circuit pattern is formed on the upper side of the first insulation layer. The first circuit pattern is formed through a via hole. A second substrate(20) including a second insulation layer and a second circuit pattern is prepared. The second circuit pattern is formed on the upper part of the second insulation layer. The second circuit pattern is formed through the via hole. A cavity corresponding to the first substrate is formed in order to install the electronic component(24). An anisotropic conductive film(22) is inserted between the second substrate and the first substrate when the cavity is formed.
申请公布号 KR20100013369(A) 申请公布日期 2010.02.10
申请号 KR20080074863 申请日期 2008.07.31
申请人 KOREA CIRCUIT CO., LTD. 发明人 KWON, JONG SANG;LIM, CHEOL HONG;PARK, JUNG GI;KIM, JEONG CHEOL;JEON, GAB JEONG
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
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