| 摘要 |
PROBLEM TO BE SOLVED: To improve testing efficiency in an easy testing process without narrowing the power range of a device in which burn-in is possible, in a burn-in test method and burn-in system. SOLUTION: In the burn-in test method of a semiconductor device by a computer, based on first measuring data resulting from a package test applied to each semiconductor device and characteristic data of a burn-in board previously stored in a database, a combination is determined where temperature difference between devices that are mounted to sockets of the burn-in board and come into contact with a heat dissipation head becomes minimum, and each semiconductor device is automatically mounted to the socket of the burn-in board with a handler according to the combination. COPYRIGHT: (C)2008,JPO&INPIT
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