| 摘要 |
PROBLEM TO BE SOLVED: To provide a method suitable for separating only the plating film formed on a metal base material, when the element of the plating film is to be analyzed. SOLUTION: The plating film separation method has a process (S4) for immersing the metal base material, having the plating film formed to a part thereof in a predetermined dissolving solution, to dissolve and remove the same. Since the concentration of the contained element, originating only from the plating film, can be measured directly by this analysis method, and trace amount of a contained substance, such as, lead can be measured with high accuracy. COPYRIGHT: (C)2008,JPO&INPIT
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