CUTTING METHOD OF BRITTLE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a cutting method of a brittle substrate capable of surely reducing fine defects on a cut end face of a glass layer without generating a breakage in the glass layer included in the brittle substrate.SOLUTION: A multilayer structure 1 is fused by laser, which is formed by laminating integrally a polymer layer 16 via an adhesive layer 14 on one main surface 121 of a glass layer 12 (step S1). Then, a main surface of the glass layer 12 adjacent to a fused end face E1 of the multilayer structure 1 is irradiated with laser beam L2, to thereby exfoliate a surface layer part of the fused end face E1 (step S3).SELECTED DRAWING: Figure 1