METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIVE CIRCUIT ELEMENTS

摘要

A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.