| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device which keeps consistency of line impedance of electronic components surface-mounted on a printed wiring board for a high frequency circuit and maintains excellent high frequency characteristics without causing a chip rise (tombstone phenomenon) or rotational deviation of a chip or the like in the mounting process of surface-mounted type chip components. SOLUTION: The electronic component device has a first land pattern connected to a first strip line, a corresponding first opposite land pattern, a second land pattern connected continuously to the first land pattern, a corresponding second opposite land pattern, a third land pattern connected continuously to the second opposite land pattern, a corresponding third opposite land pattern, and a second strip line connected to the third land pattern. The added area of the first land pattern and the second land pattern is equal to the added area of the second opposite land pattern and the third land pattern. COPYRIGHT: (C)2009,JPO&INPIT
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