| 发明名称 |
MANUFACTURING METHOD OF ARRAY SUBSTRATE |
| 摘要 |
The present invention provides a manufacturing method of an array substrate, comprising steps of: forming a gate and a gate line on a substrate; forming a gate insulating layer on the gate and the gate line; forming a pixel electrode on the gate insulating layer; and forming a first connecting via in a portion of the gate insulating layer in a non-display region and corresponding to the gate line, wherein the first connecting via is configured to connect a scanning signal trace to the gate line. |
| 申请公布号 |
US2016358953(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615133737 |
申请日期 |
2016.04.20 |
| 申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
ZHANG Pengju;DU Xiaojian;GAO Bo;YE Han |
| 分类号 |
H01L27/12;H01L29/423;H01L21/02;H01L29/51;H01L21/027;H01L21/311 |
主分类号 |
H01L27/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of an array substrate, comprising steps of:
forming a gate and a gate line on a substrate; forming a gate insulating layer on the gate and the gate line; forming a pixel electrode on the gate insulating layer; and forming a first connecting via in a portion of the gate insulating layer in a non-display region and corresponding to the gate line, wherein the first connecting via is configured to connect a scanning signal trace to the gate line. |
| 地址 |
Beijing CN |
