| 摘要 |
In order to make a plastic material available for the production of tribologically stressed components, in particular, retaining rings for holding semiconductor wafers in chemical mechanical polishing devices, retaining rings produced therefrom, with which noticeably longer service lives of the retaining rings can be obtained, as well as a process for their production, it is disclosed that the plastic material comprises a plastic matrix and particulate TiC embedded therein.
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