PATTERNING METHOD USING DRY-FILM PHOTORESIST

摘要

A method for manufacturing a pattern using a thick dry film photoresist is provided to increase the adhesion of the film by performing a bake process after a film lamination process. A thick dry film photoresist is laminated on a surface of a processing target by performing a lamination process. A bake process about the thick dry film photoresist laminated in the surface of the processing target is performed. The exposure process and the development process are performed. The bake process is performed in a temperature range of 50 to 150 degrees centigrade for 30 seconds to 20 minutes. The thick dry film photoresist includes a photoresist layer having the thickness of 50 um at least.