IMAGING MODULE, ENDOSCOPE SYSTEM, AND METHOD FOR MANUFACTURING IMAGING MODULE

摘要

The purpose of the present invention is to provide: an imaging module for which reliability of connection parts is improved while achieving a smaller sized module; an endoscope system; and a method for manufacturing the imaging module. This imaging module 100 includes: a chip sized package 10 which has an imaging element 11 and in which multiple connecting lands are disposed on a back surface of a light receiving unit 11a of the imaging element 11; a first circuit board 20 that has multiple connection electrodes which are connected to the connecting lands of the chip sized package 10; and an underfill agent 40 which fills the connection part between the chip sized package 10 and the first circuit board 20. The imaging module 100 is characterized in that the first circuit board 20 and the underfill agent 40 have a shape that fits within a projection surface in an optical axis direction of the imaging element 11 of the chip sized package 10 and in that a notch 22 that opens onto a connection surface between the first circuit board 20 and the chip sized package 10 is formed on a surface of the first circuit board 20 that intersects with the connection surface.