发明名称 FORMING METHOD FOR CONDUCTOR PATTERN OF WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide such a forming method for conductor patterns that even the designing alterations of conductor patterns and even the programming alterations of conductor patterns can be tackled thereby efficiently, and further, no difference between the stress distributions of the inside of an insulating laminated sheet is generated thereby in a laminated wiring board. <P>SOLUTION: In the forming method, for a conductor film wherewith a surface of an insulating sheet is coated, groove-form portions are so removed from it as to divide it into electrically different kinds of conductor portions. The electrically different kinds of conductor portions mean the conductor portions for making flow therein the differently qualified electricities, e.g., the ones for a power supply and a ground, the ones for a signal and a ground, and the ones for a signal circuit and another signal circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005210007(A) 申请公布日期 2005.08.04
申请号 JP20040017213 申请日期 2004.01.26
申请人 HITACHI METALS LTD 发明人 WAI SHINICHI
分类号 B23K26/00;B23K101/42;H05K3/08;H05K3/46;(IPC1-7):H05K3/08 主分类号 B23K26/00
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