SUBSTRATE FOR MICRODEVICE AND MANUFACTURING METHOD THEREOF, AND MICRODEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a microdevice which has a through wiring having a fine diameter and a high aspect ratio and a manufacturing method thereof, and to provide the microdevice and a manufacturing method thereof. SOLUTION: The substrate for the microdevice has a substrate body 31, a through hole 32 penetrating the substrate body 31 along the thickness, and the through wiring 37 buried in the through hole 32 and containing a compound of a group IV element and metal forming a compound with the group IV element. COPYRIGHT: (C)2009,JPO&INPIT