| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be stably manufactured and its manufacturing method. SOLUTION: The method for manufacturing the semiconductor package 1 is used to manufacture a semiconductor package that is provided with a semiconductor chip 6 wherein a bonding pad is formed on its surface and a semiconductor chip 9 wherein a bonding pad is formed on its surface. The method includes the steps of mounting the semiconductor chip 6 to a die pad 5; connecting a gold wire 7 to the bonding pad of the semiconductor chip 6; mounting a spacer 8 on the semiconductor chip 6, and mounting the semiconductor chip 9 thereon; arranging a holding plate 4 on the surface of the semiconductor chip 9; and connecting a gold wire 10 to the bonding pad of the semiconductor chip 9, after the holding plate 4 is arranged on the surface of the semiconductor chip 9. COPYRIGHT: (C)2005,JPO&NCIPI
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