| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a circuit module by lessening the total mounting area of an IC chip and circuit components and reducing dead spaces in dielectric boards. SOLUTION: The circuit module 10A is formed by mounting one IC chip 14 and a plurality of circuit components 16 separately on a wiring board 12, where the IC chip 14 and the circuit components 16 are sealed in a resin layer 60. Each circuit component 16 includes one or more circuits which are formed in the dielectric board 26 composed of a plurality of laminated dielectric layers, and an upper surface terminal 32 and a lower surface terminal 34 which are lead out from the upper surface and lower surface of the dielectric board 26, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
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