Substrate and method for manufacturing semiconductor package

摘要

A substrate for a semiconductor package and a method for manufacturing a semiconductor package are disclosed. The substrate comprises a surface, and package unit regions arranged on the surface in a row direction to form a plurality of rows. The package unit regions of an n+1-th row are arranged offset in a row direction from the package unit regions of an n-th row. The method includes molding semiconductor chips and spaces between the substrate and the semiconductor chips on the package unit regions of the last row at substantially the same time.

主权项

1. A substrate for a semiconductor package, the substrate comprising:
a surface; and a plurality of package unit regions arranged on the surface to form a plurality of rows in a row direction, package units regions of an n+1-th row being arranged offset in the row direction from package units of an n-th row, in which n denotes a natural number, wherein each package unit region comprises:
a chip region having a first pad; andan edge region surrounding the chip region, wherein the first pad is separated apart from the edge region in a plan view, wherein a distance from the first side of the surface to the package unit regions of a first row of the plurality of rows is less than a distance from a second side of the surface to the package unit regions of a last row of the plurality of rows, wherein the first side is opposite to the second side, wherein the surface connects the first side and the second side, wherein the package unit regions are defined by saw lines, and wherein the saw lines are recessed from the surface.