发明名称 MEMS DEVICE AND INTERCONNECTS FOR SAME
摘要 A microelectromechanical systems device having an electrical interconnect (202) connected to at least one of an electrode (16a) and a movable layer (14) within the device. At least a portion of the electrical interconnect (202) is formed from the same material as a movable layer (14) of the device. A thin film (64), particularly formed of molybdenum, is provided underneath the electrical interconnect (202). The movable layer (14) preferably comprises aluminum.
申请公布号 WO2008085252(A2) 申请公布日期 2008.07.17
申请号 WO2007US25421 申请日期 2007.12.10
申请人 QUALCOMM MEMS TECHNOLOGIES, INC.;CHUNG, WONSUK;GANTI, SURYAPRAKASH;ZEE, STEPHEN 发明人 CHUNG, WONSUK;GANTI, SURYAPRAKASH;ZEE, STEPHEN
分类号 G02B26/00;B81B7/00 主分类号 G02B26/00
代理机构 代理人
主权项
地址