A microelectromechanical systems device having an electrical interconnect (202) connected to at least one of an electrode (16a) and a movable layer (14) within the device. At least a portion of the electrical interconnect (202) is formed from the same material as a movable layer (14) of the device. A thin film (64), particularly formed of molybdenum, is provided underneath the electrical interconnect (202). The movable layer (14) preferably comprises aluminum.
申请公布号
WO2008085252(A2)
申请公布日期
2008.07.17
申请号
WO2007US25421
申请日期
2007.12.10
申请人
QUALCOMM MEMS TECHNOLOGIES, INC.;CHUNG, WONSUK;GANTI, SURYAPRAKASH;ZEE, STEPHEN