| 摘要 |
The present invention addresses the problem of providing a non-contact power supply apparatus and a non-contact power supply system which are able to achieve enhanced heat dissipation. A non-contact power supply apparatus (100) according to the present invention is provided with a power source section (10), a power supply coil (15), and a case (30) to house a target component. The case (30) is provided with a base (31) to which the target component is attached, and a cover (32) attached to the base (31) to cover the target component. The base (31) has thermal conductivity, and is formed into a plate shape. In addition, the target component is disposed on a first surface (31a), in the thickness direction, of the base (31). The cover (32) is made of a non-metallic material. The base (31) has a groove portion (33) formed in a second surface (31b) opposite to the first surface (31a) in the thickness direction. |
