| 摘要 |
<p>An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components:
(A) an epoxy resin;
(C) an inorganic filler;
(D) a curing accelerator of the general formula (1):
(E) a radical initiator;
(F) a compound having at least two maleimide group per molecule; and
(G) a phenol compound having at least one alkenyl group per molecule.</p> |
