| 发明名称 |
RADIOFREQUENCY HIGH-OUTPUT DEVICE |
| 摘要 |
A radiofrequency high-output device includes: a base plate having a mount portion and a flange portion; a frame joined to an upper surface of the mount portion; and a semiconductor chip mounted on the upper surface of the mount portion in the frame, wherein a cut or an aperture in which a screw is inserted to fix the base plate is provided in the flange portion, and a groove is provided between the mount portion and the flange portion of the base plate. |
| 申请公布号 |
US2016336255(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615044622 |
申请日期 |
2016.02.16 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
MIYAWAKI Katsumi;NISHIHARA Tatsuto |
| 分类号 |
H01L23/373;H01L23/367 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A radiofrequency high-output device comprising:
a base plate having a mount portion and a flange portion; a frame joined to an upper surface of the mount portion; and a semiconductor chip mounted on the upper surface of the mount portion in the frame, wherein a cut or an aperture in which a screw is inserted to fix the base plate is provided in the flange portion, and a groove is provided between the mount portion and the flange portion of the base plate. |
| 地址 |
Tokyo JP |
