| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for a semiconductor wafer that can improve rigidity of a semiconductor wafer, reduce the number of manufacturing facilities and costs, and that can be easily removed from a peripheral edge of the semiconductor wafer, and a semiconductor wafer handling method.SOLUTION: A jig for a semiconductor wafer providing rigidity to a thin semiconductor wafer 1 has a double-layer structure of a plane ring-shaped base material layer 10 opposed to a peripheral edge of a rear face of the semiconductor wafer 1, and an adhesion layer 14 laminated on an opposite face 12 of the base material layer 10 and adhered to the peripheral edge of the rear face of the semiconductor wafer 1 in a manner that it can be exfoliated. An exfoliating tab 15 is projected outward from an outer peripheral edge of the base material layer 10. The jig can be raised while finger tips and the like are engaged in the exfoliating tab 15, and therefore, the jig for the semiconductor wafer under a tight contact state can be easily and safely removed from the peripheral edge of the semiconductor wafer 1. |
