| 发明名称 |
ELONGATED PAD STRUCTURE |
| 摘要 |
A 3DIC includes a die and a substrate. The die includes multiple bumps to provide electrical connection the substrate. The substrate includes multiple elongated contact pads. The elongated contact pads making electrical contact with the bumps and shaped to maintain alignment with the bumps over a temperature range. |
| 申请公布号 |
US2016163669(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201514963081 |
申请日期 |
2015.12.08 |
| 申请人 |
eSilicon Corporation |
发明人 |
DeLaCruz Javier |
| 分类号 |
H01L23/00;G06F17/50;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A 3DIC comprising:
a die, the die having a plurality of bumps; and a substrate having a plurality of elongated contact pads, the elongated contact pads making electrical contact with the bumps and shaped to maintain alignment with the bumps over a temperature range. |
| 地址 |
San Jose CA US |
