PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A package structure includes a first substrate, a patterned solder mask, first thermal-conductive posts, a chip and a second substrate. The first substrate includes a first patterned metal layer, a second patterned metal layer, a first surface and a second surface. The first and second patterned metal layers are disposed on the first and second surfaces. The patterned solder mask disposed on the first and second patterned metal layers exposes part of the first and second patterned metal layers. The first thermal-conductive posts are disposed on the exposed first patterned metal layer and thermally coupled thereto. The chip is disposed on the first surface. The chip electrically connected to the first patterned metal layer is thermally coupled to the first thermal-conductive posts. Two opposite ends of each first thermal-conductive post are connected to the first and second substrates, and the first thermal-conductive posts are thermally coupled to the second substrate.

主权项

1. A manufacturing method of a package structure, comprising:
providing a first substrate, and the first substrate comprising a first surface, a second surface opposite to the first surface, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are respectively disposed on the first surface and the second surface; performing a patterning process on the first metal layer and the second metal layer to form a first patterned metal layer and a second patterned metal layer; forming a patterned solder mask on the first patterned metal layer and the second patterned metal layer, and the patterned solder mask exposing at least a part of the first patterned metal layer and the second patterned metal layer; forming a plurality of first thermal-conductive posts on the exposed part of the first patterned metal layer, and each of the first thermal-conductive posts thermally coupled to the first patterned metal layer; disposing a first semiconductor component on the first surface, and the first semiconductor component electrically connected to the first patterned metal layer and thermally coupled to the first thermal-conductive posts; and disposing a second substrate on the first substrate through the first thermal-conductive posts, wherein two opposite ends of each first thermal-conductive post are connected to the first substrate and the second substrate respectively, such that the first semiconductor component is located between the first substrate and the second substrate, and the first thermal-conductive posts are thermally coupled to the second substrate.