| 摘要 |
PROBLEM TO BE SOLVED: To provide a power supply device capable of enhancing heat dissipation of heating components.SOLUTION: A power supply device includes a substrate 31 mounting one or a plurality of heating components such as a FET10, a diode 14, a transformer 13 and a coil 15, a fixing member 20 for fixing the substrate 31, and a lid 40 attached to the fixing member 20 and covering the substrate 31. The lid 40 can be attached to the fixing member 20. The lid 40 has a pressing member 41 for pressing the heating component. More specifically, when the lid 40 is attached to the fixing member 20, the pressing member 41 presses a heating component mounted on the substrate 31, or a heating component attached to the housing 20. Consequently, each heating component comes into thermal conduction contact with the lid 31.SELECTED DRAWING: Figure 2 |
