| 摘要 |
PROBLEM TO BE SOLVED: To solve such problems that, since heating density is increased with higher performance of an electronic apparatus and an improvement in performance for cooling thereof is also required, a reduction in thermal resistance in a heat dissipation path is needed, and that, when a pressure loss in a coolant passage is increased, sufficient cooling capability cannot be ensured on a downstream side.SOLUTION: Contact thermal resistance occurring between a heat dissipation plate and a chassis is eliminated by arranging a heat exchanger arranged at the inside of the chassis to a heat dissipation plate side, and a pressure loss in the heat exchanger is made to change in accordance with the calorific value of an electronic circuit module, and thereby high heat dissipation capability can be achieved in the entire electronic apparatus.SELECTED DRAWING: Figure 1 |
